Dr. Craig L. Keast
Craig L. Keast is the Associate Division Head of the Advanced Technology Division at MIT Lincoln Laboratory (MIT-LL), the principal advanced electronics technology research and development division at the laboratory, since 2009. The 400-person division’s focus is on the invention of new device concepts, the practical realization of those devices, and their integration into systems of importance to national security. In support of its work, the division operates and maintains a complete set of specialized microelectronic and optoelectronic fabrication facilities for both silicon and compound semiconductor devices, as well as advanced electronic and optoelectronic packaging laboratories. Program work has included slit-fab fabrication activities in support of the IARPA Trusted Integrated Circuit Program, the DARPA Trusted Integrated Circuit Program, and DARPA’s Integrity and Reliability of Integrated Circuits Program. From 1994–2013, he served as the director of the Microelectronics Laboratory (ML) where he managed operations of the laboratory's DoD-Trusted $200M silicon-based semiconductor research and advanced prototyping fabrication facility. Staffed by approximately 65 scientists, engineers, and technicians working in support of over 40 different technical programs at MIT-LL. ML activities included the fabrication of flight quality megapixel CCD imagers, photon-counting avalanche photodiode arrays, RF MEMS, Nb-based superconducting circuits, sub-0.90 nm low power FDSOI CMOS, and advanced packaging technologies. From 1996–2009, he was also the leader of the Advanced Silicon Technology Group, a 45-person research group carrying out work in deep-submicron, low-power, high-performance fully depleted silicon-on-insulator (FDSOI) CMOS process development, CCD/CMOS imaging, RF MEMS, Microfluidics, and 3-dimensional circuit integration technologies. From 1992–1994, he was a technical staff member in the Submicrometer Technology Group developing device and circuit fabrication technologies utilizing 193-nm lithography. Dr. Keast received a Ph.D. in electrical engineering and computer science from the Massachusetts Institute of Technology.
Mr. Randal W. Larson
Randal W. Larson is a systems engineer with the MITRE Corporation. He has served over 40 years in engineering development and new business startups in both commercial and government sectors spanning manufacturing engineering, electrical/electronic design engineering, and systems engineering. His accumulated engineering experience includes semiconductor fabrication, electro-optic prototype development in Department of Defense (DOD) weapon systems, and design of classified, large scale, mission-critical digital processing systems for U.S. government agencies. Additionally, he was selected as part of two technology transfer programs to launch business unit startups in enterprise-level mass storage and medical imaging systems. Mr. Larson’s positions included test director, director of engineering, director of strategic planning, and general manager during these periods at Texas Instruments, Hughes Aircraft, E-Systems and Raytheon. In 2004, Mr. Larson joined MITRE/San Antonio, and was assigned to the AFLCMC/HNC “Cryptologic and Cybersecurity Systems Division (CCSD)” at Lackland Air Force Base. During the last 12 years, roles and assignments included leading the Cryptologic Modernization Strategic Planning IPT for startup of DoD Acquisition ACAT III programs, team development of next generation of DoD Public Key Infrastructure, and Air Force research study into next generation network security protocols and implementation of Service Oriented Architectures. In 2009 -2010, Mr. Larson was a MITRE lead in the DoD CNCI SCRM Pilot Program for a team representing the Air Force. Follow on work for SAF/AQXA included development of SCRM roadmap and implementation for general AF acquisition guidance. Additionally, processes and practices were developed for implementing SCRM within the CCSD crypto acquisition programs as models for the greater Air Force. Innovative approaches included methods for evaluating DIA TAC threat reports, identifying appropriate risk mitigations, and developing a tracking database of critical components as part of establishing a TSN/SCRM office. In 2015, he assisted the Director on Enterprise GPS III system (AF SMC/GPE) in establishing TSN/SCRM processes in threat/risk assessments and Program Protection planning. Mr. Larson holds a B.S.E.E. from Texas Tech.
Dr. Terry P. Lewis
Terry P. Lewis is a former executive board member on the National Academies of Science Naval Studies Board (2011-2016), graduated from the University of Southern California with a Ph.D. in Electrical Engineering Systems. Dr. Lewis is currently a Senior Associate/ Technical program Manager, Senior for Booz Allen Hamilton in Los Angeles CA, and a former Senior Program Manager & Off-site Executive with Raytheon Company in Los Angeles CA for almost 20 years. Previously, he held the technical position of Principal Systems Engineer where his areas of expertise includes: Command, Control, Computers, Communications System, Intelligence, Surveillance and Reconnaissance (C4ISR) systems design, digitized battle-space systems design and implementation, communications and transmission security design and analysis for tactical communication systems, network and key management system design and analysis for secure systems implementation. Dr. Lewis developed anti-tampering technologies to prevent or reduce the ability of potential aggressors from reverse engineering critical U.S. technologies. He was a Raytheon engineering scholar and Fellow and received the Most Promising Engineer of the year award conferred at the 2002 Black Engineer of the Year Award Conference. Dr. Lewis was a member of multiple NRC Committees and workshops such as the NRC committee on the Examination of the Air Force ISR Capability, Planning and Analysis Process, the previous workshop on Optimizing the Air Force Acquisition Strategy of Secure and Reliable Electronic Components: A Workshop and multiple other relevant NRC committees.
Mr. Aaron K. Oki
Aaron Oki is a technical Fellow at Northrop Grumman in the Northrop Grumman Aerospace Systems (NGAS), Microelectronics organization, the highest technical level in Northrop Grumman. The NGAS Microelectronics organization is a world leader in the development and production of advanced compound semiconductor technologies for military and commercial applications. Aaron holds 18 patents and has co-authored over 300 technical publications and conference papers on compound semiconductor technology. Aaron led the initial development of Gallium Arsenide HBT technology from 1985, leading to the insertion of the technology into many military and space systems for the U.S. government. In 1994 his group started working with a small 5-person start-up company, RF Micro Devices (RFMD) to use HBT technology for cellular telephone power amplifiers. HBT technology is used in over 90% of the world’s cellular handsets today. Since 2000 Aaron has expanded his role to support both microelectronics technology insertion of GaAs, InP, and GaN technologies as well as supporting major system programs on challenges with silicon and HgCdTe technologies. These programs include MILSTAR, AEHF, STSS, SBIRS, JWST, Triton, JPSS, NPOESS NPP, and even more U.S. Government National Systems. Over the 32 years at TRW/Northrop Grumman Aaron has been a strong proponent for STEM (Science, Technology, Engineering and Math) education doing volunteer university and high school lectures as well as judging science fair events. He has served as a publication reviewer for the IEEE for the past 25 years, and has served on several conference technical program committees.
Dr. Thomas E. Romesser
Thomas E. Romesser (NAE) is retired Vice President and Chief Technology Officer for Northrop Grumman Aerospace Systems until the start of 2012 and sector vice president of Aerospace Systems. In those roles, he provided senior leadership representation with customers, universities, industry, and the rest of the corporation. He also was responsible for technology development to support future programs while maintaining close linkage to legacy programs. Prior to his present assignment, Dr. Romesser was sector vice president and general manager of the Technology and Emerging Systems Division for Northrop Grumman’s former Space Technology sector. In this role, he was responsible for the development and execution of Space Technology’s strategy to support both near- and long-term business objectives, system enhancements and technology leverage for new business pursuits. He oversaw activities of the Directed Energy Systems and Advanced Concepts organizations as well as the Space Technology Research Laboratories. Previously, Dr. Romesser was vice president of technology development; responsible for the identification, development, and acquisition of Space Technology’s strategic technologies; and managed discretionary investments in technology and product development. He joined Northrop Grumman via the acquisition of TRW in 2002. A vice president since 1998, he previously served as vice president and deputy of the Space and Electronics Engineering organization. Northrop Grumman Corporation is a leading global security company whose 120,000 employees provide innovative systems, products, and solutions in aerospace, electronics, information systems, shipbuilding and technical services to government and commercial customers worldwide. Prior to that, he was vice president and general manager of TRW’s Space and Technology Division; responsible for spacecraft hardware and software engineering; manufacturing, testing and space vehicle production; as well as chemical and solid-state laser design and development; sensor systems, space and tactical propulsion systems; and research in the physical, chemical and engineering sciences. Dr. Romesser earned a B.S. in physics from Manhattan College and an M.S. and a Ph.D. from the University of Iowa. He is also a graduate of the USC Executive Management Program. Dr. Romesser was elected a fellow of the Directed Energy Professional Society in 2002 and a member of the National Academy of Engineering in 2003.